TransDimension Licenses High-Speed USB Intellectual Property and Software Solution to Chipidea; Chipidea to Offer the Only Complete High-Speed SoC Solution; Reduces Risk and Time-to-Market
IRVINE, Calif. & PORTO, Portugal—(BUSINESS WIRE)—July 13, 2005—
TransDimension (TDI), the leader in USB connectivity
solutions for embedded applications and Chipidea, the leading analog
and mixed-signal semiconductor solutions provider, today announced a
strategic partnership to provide the industry's only complete
high-speed USB intellectual property (IP) solution. Combining the
strengths and expertise of both companies, the result of the
partnership is a complete SoC solution that encompasses Chipidea's
Physical Layer (PHY) IP core and TDI's High-Speed USB IP core and
industry leading software.
As USB becomes a "need to have" feature in most SoCs, system
architects and chip designers are faced with a major obstacle: how to
get around incompatible IP blocks to design USB into an SoC in a
matter of weeks. The partnership between Chipidea and TDI addresses
this challenge by offering a single source solution for the three
critical components of a successful USB implementation -- the PHY, USB
controller IP and software.
According to Milton Sousa, Chipidea business development manager,
"We are granting our customers a complete solution encompassing the
PHY, controller and software that will strongly reduce time to market
and minimize risk. Our experience demonstrates that this complete
solution can save months of design time and eliminate a great deal of
frustration when compared to integrating IP from different sources.
Our solution with TDI provides the most complete, integrated solution
available in the market."
All components of this joint solution were developed by Chipidea
and TDI, and building on a long product relationship the companies
have now extended their relationship to commercially offer a solution
that is demonstrated in silicon and has been fully tested for
interoperability. "Our complete solution is in use by major OEMs
worldwide and has been proven successful in high-volume applications,"
said Pete Todd, TDI vice president of sales. "USB implementations are
the primary focus for our company -- it's what we do. Other solutions
lack the software that is proven to be interoperable with the hardware
elements. Through our single source solution we offer the three
critical components of a USB implementation that have proven
interoperability as well as provide a single support team and a single
point of contact through the world-class team at Chipidea."
The announcement of this partnership comes on the heels of a joint
webinar offered by Chipidea and TDI titled, "Simplifying the
Integration of High-Speed USB Into Your SoC." Broadcasted on
Wednesday, June 22, the webcast featured experts from Chipidea and TDI
and shared insights on the challenges associated with using separate
vendors, typical problems faced by SoC manufacturers and the benefits
of a single source solution. The companies highlighted a comparison
study that explored an IP implementation and demonstrated the benefits
realized with a complete, single source solution. To view an archived
version of the webcast, please visit
http://seminar2.techonline.com/s/transdimensiongr1_jun2205.
For more information, please contact products@chipidea.com.
About Chipidea
Chipidea is the world's number one analog/mixed-signal merchant
technology supplier targeting fast-growing market segments like
wireless communications, digital media and consumer electronics.
Chipidea supports blue-chip customers across the globe, has an
impeccable reputation for delivering high-quality products and is
known for its reliable execution. Chipidea licenses its technology to
leading companies in these and other key markets, delivering
everything from precision single-function blocks to full analog
sub-systems. Chipidea employs 180 people in its research and
development, and sales and marketing offices across Europe, Asia and
North America. More information about Chipidea can be found at
http://www.chipidea.com.
About TransDimension
Headquartered in Irvine, California, TransDimension is a privately
held company founded in 1997 to develop and market connectivity
solutions. TransDimension's product lines include the integrated
circuits, IP cores and USB software stacks that enable wired and
wireless connectivity between a wide range of PC peripheral, consumer
electronic and mobile device applications. TransDimension's SoftConnex
USB solutions provide the broadest operating system and CPU platform
support and the largest library of peripheral class drivers available.
More information about TransDimension can be found at
http://www.transdimension.com.
Product or service names mentioned herein are the trademarks of
their respective owners.
Contact:
For TransDimension:
Lages & Associates
Jennifer Tolkachev, +1 949-453-8080
Email Contact
or
For Chipidea:
Chipidea Microelectronica
Jose-Maria Moniz, +351 210336300
Email Contact
